CONTENTS

    Issues to be noted in the SMT assembly of Rigid-flex PCBS

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    Tony Zh Yi
    ·May 4, 2025
    ·12 min read
    Issues to be noted in the SMT assembly of Rigid-flex PCBS
    Image Source: pexels

    The SMT assembly of Rigid-flex PCBs needs close attention. You must solve key problems to make them work well and last long. Good solder masks and exact solder paste use are very important. They protect the PCB and make strong electrical links. Using the right assembly steps lowers issues like bad wetting or gaps, making them more reliable.

    Key Takeaways

    • Handle and store Rigid-flex PCBs carefully before assembly. Keep them in the right temperature and humidity to avoid harm.

    • Use checks like Automated Optical Inspection (AOI) to make sure parts are placed correctly. This helps prevent problems later.

    • Pick good materials for both rigid and flexible parts. Polyimide works well for bending, and rolled-annealed copper is great for circuits.

    Common Challenges in SMT Assembly for Rigid-flex PCBs

    Warping and Flexing During Assembly

    Rigid-flex PCBs mix rigid and flexible layers. This makes them bend or warp during SMT assembly. Fixing this is key to keeping the board stable and working well.

    • Material Compatibility: Rigid and flexible layers use different materials. These materials expand and shrink differently when heated. If not controlled, this can cause warping.

    • Handling and Manipulation: Flexible parts need gentle handling. Bending too much or storing them wrong can damage them permanently.

    • Solder Joint Reliability: Moving parts can stress solder joints. This can make them weak and fail over time.

    To reduce warping, keep it under 0.75% for most boards. For larger boards with tiny parts, aim for 0.5%. Choose good materials and design the layers carefully to keep the board strong and signals clear.

    Tip: Add stiffeners or supports to strengthen flexible parts during assembly.

    Component Placement Accuracy

    Placing parts correctly is very important for Rigid-flex PCBs. If parts are not aligned, they may not connect well, fail, or even fall off.

    • Tombstoning happens when parts tilt during soldering. This causes bad connections.

    • Missing parts, especially important ones, can stop the circuit from working.

    Use quality checks like Automated Optical Inspection (AOI) and X-ray inspection to find placement mistakes. Here's a table comparing common methods:

    Quality Control Method

    Description

    Visual Inspection

    Check solder joints and part placement with magnifiers and lights.

    Automated Optical Inspection (AOI)

    Spot and sort SMT problems using set rules.

    X-ray Inspection

    Look at hidden solder joints, like those under BGAs or CSPs.

    Electrical Testing

    Test how well the PCB works using in-circuit or functional tests.

    Process Control

    Watch key steps like solder paste printing and part placement.

    Note: Strong quality checks make boards more reliable and save on fixing costs.

    Thermal Stress and Heat Management

    Heat stress is a big problem during SMT assembly. Rigid-flex PCBs face high heat during soldering, which can cause damage.

    Thermal shock testing checks if the board can handle quick temperature changes. Burn-in testing heats the board for a long time to find weak spots.

    Test Type

    Description

    Implications on Stress Levels

    Thermal Shock Testing

    Tests if the PCB can handle fast temperature changes.

    Finds heat-related stress, cracks, and other failures.

    Burn-in Testing

    Heats the board for a long time to test it.

    Shows weak points and how it performs under heat stress.

    To handle heat better, use materials that spread heat well. Adjust the reflow process to avoid overheating.

    Solder Joint Reliability on Flexible Sections

    Solder joints in flexible parts face bending and stress. Keeping them strong is important, especially for things like car electronics.

    Thermal cycling and vibration tests check how long solder joints last under tough conditions. Watching electrical signals can catch problems early and help fix them.

    Tests show thinner boards and smaller pads make solder joints last longer. For example:

    Parameter

    Effect on Solder Joint Fatigue Life

    Board Thickness

    Thinner boards (0.016 inch) last twice as long as thicker ones (0.062 inch).

    Attachment Pad Size

    Smaller pads (12 mils) last 25% longer than bigger ones (16 mils) for flex-based CSPs.

    Tip: Use glue and supports to make solder joints stronger in flexible areas.

    Design Considerations for Rigid-flex PCBs in SMT Assembly

    Material Selection for Rigid and Flexible Layers

    Picking the right materials is key for good performance. Flexible layers often use polyimide because it handles heat well and bends easily. Copper is used for circuits, with rolled-annealed copper preferred for flexible parts to make bending easier.

    Material Type

    Description

    Considerations

    Polyimide

    Used for flexible layers. Thickness depends on bend radius.

    Choose thickness based on cost and how much it needs to bend.

    Copper

    Needed for circuits. Rolled-annealed copper is best for flexible parts.

    Pick type and thickness based on current needs and flexibility.

    Stiffeners

    Strengthen parts or make sections thicker.

    Use polyimide for thin areas; FR4 for flexible sections needing extra support.

    Adhesives

    Includes acrylic, epoxy, and polyimide-based options.

    Pick based on use; acrylic and epoxy are common, polyimide is less used.

    Tip: Match materials to the job and environment for lasting reliability.

    Optimizing Trace Layout for Flexibility

    Trace layout is important for keeping signals clear and parts strong. Adjust trace shapes to control signal flow and reduce interference. Ground planes help lower noise, while careful routing keeps traces within limits.

    • Arrange traces in staggered patterns to avoid stress buildup.

    • Use curved paths instead of sharp corners for smoother routing.

    • Try simulation tools to spot problems early in the design process.

    Note: Good trace layouts improve signal flow and cut down on noise.

    Managing Bend Radius and Stress Points

    The bend radius shows how much the flexible part can bend safely. For single-sided flex, keep the bend radius 3–6 times the thickness. Multilayer flex designs need a bend radius of 10–15 times the thickness.

    FLEX TYPE

    MINIMUM BEND RADIUS

    Single sided flex

    3 – 6 x circuit thickness

    Double sided flex

    7 – 10 x circuit thickness

    Multilayer flex

    10 – 15 x circuit thickness

    Dynamic application

    20 – 40 x circuit thickness

    Tip: Follow IPC-2223 rules to make sure flexible parts bend safely and work well.

    Incorporating Stiffeners and Support Structures

    Stiffeners and supports make flexible parts stronger and stop too much bending. Polyimide stiffeners are good for thin areas, while FR4 stiffeners give strong support to flexible parts.

    • Add stiffeners to strengthen areas with components or connectors.

    • Use strain relief fillets to lower wear and tear.

    • Include supports to stop bending during assembly.

    Emoji Insight: 🛠️ Adding stiffeners makes flexible parts tougher and reduces damage during assembly.

    Best Practices for SMT Assembly of Rigid-flex PCBs

    Best Practices for SMT Assembly of Rigid-flex PCBs
    Image Source: pexels

    Pre-assembly Handling and Storage Guidelines

    Taking care of Rigid-flex PCBs before assembly is very important. It helps keep their quality and makes them last longer. Follow rules like IPC-1601 A for proper handling and storage. These steps make the PCBs work better and last longer in devices.

    Here are some simple tips to follow:

    • Control Humidity: Keep PCBs in a dry place with less than 50% humidity. Use moisture-proof bags and desiccant packs to stop water damage.

    • Temperature Regulation: Store PCBs between 20°C and 25°C to avoid heat problems.

    • Avoid Physical Damage: Handle PCBs gently to avoid scratches or bending. Use anti-static gloves and the right tools.

    • FIFO Method: Use the "First In, First Out" rule. This ensures older boards are used first, avoiding material spoilage.

    Tip: Always check PCBs for water damage or scratches before starting assembly.

    Choosing the Right Reflow Profile

    Picking the right reflow profile is key for good soldering. The reflow process heats the PCB to melt solder paste and connect parts. A good thermal profile avoids mistakes and ensures strong connections.

    Studies show controlling heat during reflow is very important. Even with better heat tools, keeping quality steady can be hard. Using models to predict settings can help improve results.

    Key Findings

    Description

    Thermal Profile Optimization

    Splits reflow into six zones, focusing on heat and time above liquids.

    RSM Method

    Uses Response Surface Methodology (RSM) to find the best settings.

    Influential Variables

    Conveyor speed is a key factor for good soldering.

    To get the best results:

    1. Slowly heat the PCB in the preheat zone to avoid shocks.

    2. Use the soak zone to spread heat evenly.

    3. Keep the time above liquidus (TAL) between 60-120 seconds for proper soldering.

    Note: Check and adjust the reflow oven often to keep results consistent.

    Using Adhesives and Reinforcements

    Adhesives and reinforcements make Rigid-flex PCBs stronger during assembly. They hold parts in place, protect solder joints, and make the board last longer.

    • Adhesive Types: Acrylic or epoxy adhesives are good for most uses. Polyimide adhesives work well in hot conditions.

    • Reinforcement Techniques: Add stiffeners to flexible parts to stop too much bending. Use strain relief fillets to lower stress on solder joints.

    • Application Tips: Spread adhesives evenly to avoid uneven stress. Let them dry fully for a strong bond.

    Tip: Pick adhesives and reinforcements based on how the PCB will be used.

    Ensuring Proper Alignment and Fixturing

    Good alignment and fixturing are needed for placing parts correctly. If parts are not aligned, they may fail or cause bad connections.

    To ensure good alignment:

    1. Use strong fixtures to hold the PCB steady during assembly.

    2. Use automated machines to place parts accurately.

    3. Regularly check and adjust assembly tools for precision.

    Fixtures also stop bending during the reflow process. For flexible parts, use temporary stiffeners or supports to keep them stable.

    Emoji Insight: 🔧 Good alignment and fixtures help your assembly process work smoothly and reliably.

    Quality Control and Testing in SMT Assembly

    Visual Inspection and Automated Optical Inspection (AOI)

    Checking Rigid-flex PCBs for problems is very important. Visual inspection lets you spot issues like bad soldering or broken traces by hand. But for complex boards, AOI works faster and finds more mistakes. AOI uses cameras and smart software to detect missing parts or weak solder joints.

    Tip: Use both visual checks and AOI to find all defects.

    Electrical Testing for Continuity and Shorts

    Electrical tests make sure the PCB works correctly. Continuity tests check if all paths are connected. Short tests find unwanted links between traces. These tests confirm the circuit is good before moving forward.

    ISO Standard

    Description

    Impact on SMT Processes

    ISO 9001

    Quality management system

    Ensures clear steps and better quality in PCB making.

    Flex Testing for Durability

    Flex testing checks how flexible parts handle bending over time. This is key for things like wearables or car electronics that move a lot. It copies real-life use to find weak spots and improve strength.

    Thermal Cycling and Environmental Stress Testing

    Thermal cycling tests how well the PCB handles temperature changes. The board faces hot and cold cycles, from -40°C to +85°C. This shows problems like weak solder joints or parts that might fail.

    Aspect

    Details

    Purpose

    Tests if the PCB can handle changing temperatures.

    Method

    Board faces both high and low temperatures repeatedly.

    What it reveals

    Finds stress from heat changes, solder issues, and weak parts.

    Note: Regular tests ensure your assembly meets standards like ISO 14001:2015, making it reliable and eco-friendly.

    How LTPCBA Ensures Excellence in SMT Assembly

    Advanced Technology and Automated Systems

    To make SMT assembly precise, advanced tools are needed. LTPCBA uses modern machines like automated pick-and-place systems and reflow ovens. These tools place parts correctly and solder them evenly. Automation helps reduce mistakes and speeds up the process.

    Tip: Using automated tools makes work faster and more accurate.

    Quality Assurance with International Standards

    LTPCBA follows strict global rules like ISO, IATF, and UL. These certifications prove their processes meet high-quality standards. You can trust their PCBs to be safe and reliable for many uses.

    Comprehensive Testing and Inspection Processes

    Testing is key to making strong Rigid-flex PCBs. LTPCBA uses inspections like AOI and X-ray testing to find problems. These tests catch errors like misplaced parts or weak solder joints. Electrical tests check if the board works properly.

    Testing Method

    Purpose

    AOI

    Finds part placement mistakes

    X-ray Testing

    Checks hidden solder joints

    Electrical Testing

    Confirms the circuit works

    Note: Careful testing ensures your PCBs are top quality.

    Customer-focused Solutions for Rigid-flex PCBs

    LTPCBA puts your needs first with custom solutions. Whether you need samples or medium production, they respond quickly and offer 24-hour support. Their skilled team ensures your Rigid-flex PCBs match your exact needs.

    Emoji Insight: 🤝 LTPCBA’s focus on customers guarantees your happiness.

    Solving problems in SMT assembly of Rigid-flex PCBs improves their performance. Follow smart steps like better designs, controlling heat, and testing carefully.

    • Test signal and power flow early with simulations.

    • Add test points to make checking easier.

    • Work with assembly experts to improve designs.

    Careful testing and planning help Rigid-flex PCBs handle bending, heat, and other stresses they face during use.

    LTPCBA makes top-quality Rigid-flex PCBs. They use modern tools, follow IPC and ISO rules, and do thorough tests to ensure the best results.

    FAQ

    What is the main advantage of using Rigid-flex PCBs?

    Rigid-flex PCBs are strong and bendable. They save room, weigh less, and work well in gadgets with tricky designs or moving parts.

    How can you prevent warping during SMT assembly?

    Pick matching materials, treat PCBs carefully, and use stiffeners. These actions lower stress and keep the board steady while assembling.

    Why is thermal cycling important for Rigid-flex PCBs?

    Thermal cycling checks if the PCB can handle heat changes. It finds weak solder spots and ensures the board works in tough conditions.

    Tip: Test your PCBs in real-life settings to check strength and dependability.

    See Also

    Essential Safety Measures for HDI PCB Surface Mount Assembly

    Understanding SMT and DIP Assembly for PCBA Processes

    Choosing PCB Materials for Effective SMT Assembly Processes

    Top Strategies for Optimizing SMT Lines in PCBA Production

    Fundamental Criteria for PCB Boards in SMT Manufacturing